Innovative Management Framework
As the technology leader in dedicated IC foundry, TSMC makes product innovations in collaboration with customers, talent innovations in cooperation with academic institutes, and green innovations with suppliers. Over the years we have driven continued progress in global technology and brought about the proliferation of a convenient digital lifestyle.
Leading Technology and Innovations in IC Foundry Service
The efforts of TSMC R&D organization are focused on enabling the Company to continuously offer its customers first-to-market, leading-edge technologies and design solutions that contribute to their product success in today's competitive market environment.
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CMOS Logic Technology
- Led the industry in volume manufacturing of 16FF+ technology, which operated 40% faster than planar 20nm technology or consumed 50% less power at the same speed.
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Specialty Technology/Integrated Interconnect and Packaging
- Successfully qualified InFO PoP (Integrated Fan-Out Package on Package) advanced packaging technology, low cost solution for mobile customers.
- The third generation of 0.18um BCD technology adopted TSMC proprietary device structure which boosted world leading performance higher.
- The first and the only company to offer both 100V and 650V GaN foundry service in a 6-inch fab.
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CMOS Logic Technology
- Completed the transfer to manufacturing of industry-leading 10nm technology, the 3rd generation of technology platform to make use of 3D FinFET transistors.
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Specialty Technology/Integrated Interconnect and Packaging
- Achieved the world's first high-volume production of InFO PoP for mobile application processor packaging.
- 0.18um second generation BCD technology resulting in the world's highest performance quick charger and wireless charger.
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CMOS Logic Technology
- Completed the transfer to manufacturing of the industry leading 7nm technology, the 4th generation of technology to make use of 3D FinFET transistors.
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Specialty Technology/Integrated Interconnect and Packaging
- The world's leading volume production of InFO PoP Gen-2 for mobile application processor packaging.
- Launched 0.18um third generation BCD technology resulting in the leading performance quick charger and wireless charger.
- 40nm high-voltage phase-2 technology readiness for both LCD (Liquid-Crystal Display) and OLED(Organic Light-Emitting Diode) drivers.
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CMOS Logic Technology
- N7+ technology entered risk production, the industry's First commercially available EUV (extreme ultraviolet) process technology.
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Specialty Technology/Integrated Interconnect and Packaging
- Foundry's first under panel optical fingerprint sensor technology in production.
- Developed an industry's unique 90nm BCD technology offering leading-edge 5-16V power devices and dense logic integration with competitive cost, as the next generation mobile Power Management IC (PMIC) solution.
- Mass production launch of new generation CMOS image sensors of sub-micron pixel for mobile applications and development of Ge-on-Si sensor for three dimensional range sensing applications with superior performance.
- High-volume production of InFO-PoP Gen-3 for mobile application processor packaging.
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CMOS Logic Technology
- 5nm FinFET technology led the foundry to successfully entered risk production.
- 7nm FinFET plus technology entered volume production and led the world to deliver customer products to market in high volume.
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Specialty Technology/Integrated Interconnect and Packaging
- The World's first 7nm automotive platform
- Completed process validation for System on Integrated Chips (SoIC®), an innovative wafer-level package technology
- Achieved High-volume production of Gen-4 Integrated Fan-Out Package on Package (InFO-PoP) for mobile processor packaging
- Successful qualification of Gen-5 InFO-PoP advanced packaging technology for mobile applications and Gen-2 Integrated Fan-Out on Substrate (InFO-oS) for HPC applications
- Developed 40nm BCD (Bipolar-CMOS-DMOS) technology ‒ unique in the industry ‒ offering leading-edge 20-24V HV devices with full compatibility to 40nm ultra-low-power platform and integration of RRAM, in turn, enabling low power, high integration and small footprint for high-speed communication interface in mobile applications
- Developed 28nm eFlash for high performance mobile computing and high performance low-leakage platforms, which achieved technical qualification for automobile electronics and micro controller units (MCU)
- Developed the latest generation CMOS image sensors of sub-micron pixel for mobile applications and embedded 3D metal-insulator-metal (MiM) high-density capacitors for global shutter and high dynamic-range sensor applications
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Applications
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TSMC continued to expand its scale of research and development in 2019. The total R&D expenditure for the year was US$ 2.959 billion, a 4% increase from the previous year and 8.5% of the Company's total revenue. The R&D team has grown to a team of 6,534 people, a 5% increase from the previous year.
A strong portfolio of intellectual property rights strengthens TSMC's technology leadership. As of 2019, TSMC's patent portfolio has reached over 39,000 patents worldwide to ensure the Company's technology leadership and maximum profit.
More Advanced and More Energy-efficient Electronic Products
TSMC is consistently first among dedicated foundries to provide next-generation, leading-edge technologies. Through TSMC's manufacturing technologies, customers' designs are realized and their products are used in a broad variety of applications. These chips make significant contributions to the progress of modern society.
Product Life Cycle Environmental / Social Impacts Consideration
TSMC considers, clarifies and compares environmental impacts of each stage based on product life cycle, including product design, raw material mining, production and transportation, product manufacturing and transportation, usage, and waste disposal to raise product environmental friendliness.
Environmental Impact Management
Social Impact Management
In 2019, TSMC finished the product life cycle, carbon footprint, and water footprint assessments on every manufacturing facility in Taiwan. The Company also achieved ISO14040, ISO14067, and ISO14046 certification. In efforts to reduce the environmental footprint of its products, TSMC is continuing to make progress in company-wide reductions of greenhouse gas emissions, energy and water conservation, waste minimization and reusability cycles, and pollution prevention. The Company also actively requires and assists its upstream and downstream supply chain partners to invest in similar initiatives.
Wafer Product Life Cycle Assessment (eq average of an 8-inch wafer)
For more information, please read TSMC 2019 Corporate Responsibility Report:
Innovation and Service - Innovation Management
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