TSMC Celebrates 10TH Anniversary for OIP
TSMC celebrated the 10th anniversary of Open Innovation Platform® (OIP) in 2018. TSMC North America Chief Executive Officer David Keller unveiled the theme of “Collaborating at a New Level” during the OIP Ecosystem Forum in California, and Dr. Cliff Hou, TSMC Vice President of Technology Development made the official announcement the 5th OIP Alliance – the Cloud Alliance. The inaugural members, Amazon Web Services (AWS), Cadence, Microsoft Azure, and Synopsys, have worked with TSMC to drive a new industry partnership to pave the way for future innovations. Followed with invited keynote by Kushagra Vaid, Microsoft General Manager & Distinguished Engineer of Azure Infrastructure, highlighting the new collaboration with TSMC in Cloud computing to facilitate customer’s adoption of Cloud resources and apply them securely in their semiconductor designs.
Cloud Alliance Boosts OIP Productivity
OIP brings together the semiconductor design community, TSMC’s ecosystem partners, TSMC’s Intellectual Property (IP), design implementation, Design for Manufacturability (DFM) capabilities, process technology and backend packaging & testing services. There are currently five OIP Alliances, including the EDA Alliance, IP Alliance, DCA Alliance, VCA Alliance and the newly announced Cloud Alliance.
Dr. Cliff Hou, TSMC Vice President of Technology Development, highlighted that collaboration between TSMC and the Cloud Alliance on the development of OIP Virtual Design Environment (VDE) will provide a complete system-on-chip (SoC) design environment for semiconductor customers to design securely in the Cloud, together with TSMC OIP design infrastructures within the Cloud services. This helps customers to further enhance productivity by leveraging the power and flexibility of the Cloud and shorten the cycle time of time-to-market.
The 5TH OIP Alliance – the Cloud Alliance
Three Major Benefits of the Cloud Solution
TSMC OIP Virtual Design Environment (OIP VDE) Lowers Entry Barrier for Customer’s Adoption of Cloud Usage
TSMC has also become a Cloud service user by conducting foundation IP development on the Cloud for its most advanced technology nodes. By leveraging tens of thousands of CPU cores on the Cloud, TSMC is now able to better manage development and ensure on-time delivery during peak demand, while achieving higher quality and conducting more effective Power, Performance and Area (PPA) optimization. TSMC continues to develop OIP solutions that can assist customers to innovate and successfully roll out their products with higher quality and lower energy consumption through integration of different kinds of R&D resources and strong collaboration with ecosystem partners.
Customers Adopt TSMC’s Latest Technologies and OIP Solutions
In addition to the announcement of Cloud Alliance, Dr. Cliff Hou highlighted the status of customer’s adoption of design enablement platforms in advanced technologies and corresponding OIP solutions. TSMC continues to provide a comprehensive portfolio of EDA and IP solutions with the goal of improving customer’s first-time silicon success in the latest technologies by meeting design requirements at various stage and speeding up the realization of the innovation ideas.
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